Huntsville, Ala. – March, 24, 2016 – CFDRC has teamed with experts in the field of microelectronics and packaging reliability to win a $1.0M contract from the Missile Defense Agency (MDA) to develop a physics based modeling and testing protocol to correlate material properties and thermal loading conditions to stress related failure.
Thermally induced fatigue and residual stress introduced during fabrication are sources of failure in microelectronics, which raises reliability concerns for MDA and its system integrators.
This project includes the development of the test and modeling protocols, generation of data to parameterize models and application of the models to the study of thermal fatigue in adhesive bonded components.
The end use of the modeling and testing protocol is to extract design rules and materials selection guidelines to allow MDA and its prime contractors to mitigate component failures related to CTE mismatch through improved designs and materials selection and with reduced long-duration cyclic testing.
About CFD Research Corporation: Since its inception in 1987, CFDRC has worked with government agencies, businesses and academia to provide innovative solutions within the Aerospace & Defense, Biomedical & Life Sciences, and Energy & Materials industries. Over the years CFDRC has earned multiple national awards for successful application and commercialization of innovative component/system technology prototypes, multi-physics simulation software and multi-disciplinary analyses. Learn more at www.cfdrc.com.
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